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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 16 tsz02201-0rdr0gz00270-1-2 ? 2014 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 tsz22111 ? 14 ? 001 www.rohm.com general purpose cmos logic ic quad-analog switch bu4066bc bu4066bcf bu4066bcfv general description the bu4066bc series ics each contain 4 independent switches capable of controlling either digital or analog signals. features ? low power consumption ? wide operating supply voltage range key specifications ? operating supply voltage range: 3v to 18 v ? input voltage range: v ee to v dd ? operating temperature range: - 40 c to +85c packages w(typ) x d(typ) x h(max) dip14 19.40mm x 6.50mm x 7.95mm sop14 8.70mm x 6.20mm x 1.71mm ssop-b14 5.00mm x 6.40mm x 1.35mm truth table inputs switches cont.a h sw a is turned on. (1pin 2pin ) l sw a is turned o ff . (1pin 2pin ) cont.b h swb is turned on. (3pin 4pin ) l swb is turned off. (3pin 4pin ) cont.c h swc is turned on . (8pin 9pin ) l swc is turned off. (8pin 9pin ) cont.d h swd is turned on. (1 0pin 11 pin ) l swd is turned off. ( 10 pin 11 pin ) dip14 sop14 ssop-b14 datashee t downloaded from: http:///
2/ 16 tsz02201-0rdr0gz00270-1-2 ? 2014 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv pin configuration pin description pin no. pi n name i/o function 1 in/out .a i/o analog switch input / output .a 2 out/in .a i/o analog switch input / output .a 3 out/in .b i/o analog switch input / output .b 4 in/out .b i/o analog switch input / output .b 5 cont.b i control input .b 6 cont.c i control input .c 7 vee - power supply(-) 8 in/out .c i/o analog switch input / output .c 9 out/in .c i/o analog switch input / output .c 10 out/in .d i/o analog switch input / output .d 11 in/out .d i/o analog switch input / output .d 12 cont.d i control input .d 13 cont.a i control input .a 14 vdd - power supply(+) (top view) 1 2 4 5 6 7 14 13 12 9 8 in/out.a vee vdd cont.a in/out .d out/in .d out/in .c in/out.c out/in .a out/in .b in/out .b cont.b cont.c cont.d 11 3 10 out/in in/out swa swd out/in in/out in/out out/in swb swc in/out out/in downloaded from: http:///
3/ 16 tsz02201-0rdr0gz00270-1-2 ? 2014 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv block diagram absolute maximum ratings (t a = 25c) parameter symbol rating unit supply voltage v dd - 0. 5 to + 20 .0 v input voltage v in (v ee - 0. 5) to (v dd +0.5) v control input current i in 10 ma operating temperature t opr -40 to +85 c storage temperature t stg -55 to +150 c maximum junction temperature t jmax +150 c power dissipation p d dip14 1.18 (note 1) w sop14 0.56 (note 2) ssop-b14 0.87 (note 3) caution: operating the ic over the absolute maximum ratings may damage the ic. t he damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefor e, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. (note 1) reduce 9.5mw/c above 25c. (note 2) mount ed on 70.0mm x 70.0mm x 1.6mm board glass epoxy board, reduce 4 .5mw/c above 25c. (note 3) mount ed on 70.0mm x 70.0mm x 1.6mm board glass epoxy board, reduce 7 .0mw/c above 25c. recommended operating conditions (t a = - 40 c to +85 c ) parameter symbol min typ ma x unit supply voltage v dd 3.0 - 18 .0 v input voltage v in v ee - v dd v in / out.a to d out / in .a to d cont.a to d downloaded from: http:///
4/ 16 tsz02201-0rdr0gz00270-1-2 ? 2014 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv electrical characteristics (unless otherwise specified v ee =0v t a =25c) parameter symbol min typ max unit conditions dc characteristics input h voltage v ih 3.5 - - v v dd =5v - 7.0 - - v dd =10v 11.0 - - v dd =15v input l voltage v il - - 1.5 v v dd =5v - - - 3.0 v dd =10v - - 3.75 v dd =15v input h current i ih - - 0.3 a v dd =15v v ih =15v input l current i il - - -0.3 a v dd =15v v il =0v on resistance r on - 500 600 v dd =5v cont=5v v in = 2.5v r l =10k - 120 500 v dd =10v cont=10v v in =5v r l =10k - 80 280 v dd =15v cont=15v v in =7.5v r l =10k on resistance defluxion r on - 25 - v dd =5v v in =v dd /2 r l =10k - 10 - v dd =10v - 5 - v dd =15v channel-off leakage curr ent i off - - 0.3 a v dd =15v v in =15v v out =0v - - -0.3 v dd =15v v in =0v v ou t =15v static supply current i dd - - 1.0 a v dd =5v v in =v dd or v ee - - 2.0 v dd =10v - - 4.0 v dd =15v input capacitance (control input) c c - 8 - pf - f=1mhz input capacitance (switch input) c s - 10 - pf - f=1mhz switching characteristics, c l =50pf propagation delay time inout t plh t phl - 20 50 ns v dd =5v r l =10k - 12 40 v dd =10v - 10 30 v dd =15v propagation delay time contout t phz ,t plz - 40 90 ns v dd =5v r l =1k - 35 80 v dd =10v - 30 70 v dd =15v propagation delay time contout t pzh ,t pz l - 60 140 ns v dd =5v r l =1k - 20 50 v dd =10v - 15 40 v dd =15v feed through attenuation f t - 0.7 - mhz v dd =5v v ss =- 5v r l =10k v in =5v p-p v out =-50db sine wave distortion d - 0.1 - % v dd =5v v ss =- 5v r l =10k v in =5v p-p cross t alk contout c tc - - 600 mv p-p v dd =5v v ss =- 5v r l =10k,f=1mhz v in =5v p-p cross t alk between channels c t - 1 - mhz v dd =5v v ss =- 5v r l =10k v in =5v p-p ,v out =-50db downloaded from: http:///
5/ 16 tsz02201-0rdr0gz00270-1-2 ? 2014 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv waveforms of switching characteristics figure 1. propagation delay time inout (t phz ,t plz ) input/output waveform figure 3. propagation delay time contout (t pzh ,t phz ) input/output waveform figure 5. propagation delay time contout (t pzl ,t p lz ) input/output waveform figure 2. propagation delay time inout (t phz ,t plz ) test circuit figure 4. propagation delay time contout (t pzh ,t phz ) test circuit figure 6. propagation delay time contout (t pzl ,t p lz ) test circuit in /out (input) out/in (output) v dd v ee t plh t p hl 50% 50% v dd cont r l in /out out/in p.g 50% 50% v ee c l v ee cont (input) out/in (output) v ee v dd 50% t pzh 50% t p hz 90% out/in r l v dd p.g cont in /out c l 50% v ee v ee t p lz cont (input) out/in (output) v ee v dd 50% t pz l 50% 10% out/in v dd v dd v ee r l p.g cont in /out c l 50% out/in r l cont in /out v dd v ee v in = v dd /2 v ee v out r on = r l (v in /v out - 1) figure 7. on resistance (r on ) test circuit downloaded from: http:///
6/ 16 tsz02201-0rdr0gz00270-1-2 ? 2014 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv typical performance curves figure 8. on resistance vs input voltage (v dd =3v, v ee =0v, cont=3v) figure 9. on resistance vs input voltage (v dd =5v, v ee =0v, cont=5v) 0 150 300 450 600 750 900 0 1 2 3 4 5 input voltage [v] on resistance [] 85c 25c -40c figure 10. on resistance vs input voltage (v dd =10v, v ee =0v, cont=10v) figure 11. on resistance vs input voltage (v dd =15v, v ee =0v, cont=15v) 0 150 300 450 600 750 900 0 2 4 6 8 10 input voltage [v] on resistance [] 85c 25c -40c 0 150 300 450 600 750 900 0 3 6 9 12 15 input voltage [v] on resistance [] 85c 25c -40c 0 200 400 600 800 1000 1200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 input voltage [v] on resistance [] 85c 25c -40c downloaded from: http:///
7/ 16 tsz02201-0rdr0gz00270-1-2 ? 2014 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv typical performance curves - continued 0 10 20 30 40 50 -50 -25 0 25 50 75 100 ambient temperature [c] propagation delay time [ns] operating temperature range v dd =3v v dd =5v v dd =10v v dd =18v 0 40 80 120 160 200 -50 -25 0 25 50 75 100 ambient temperature [c] propagation delay time [ns] operating temperature range v dd =3v v dd =5v v dd =10v v dd =18v figure 13. propagation delay time in out(t phl ) vs ambient temperature figure 12. propagation delay time in out(t plh ) vs ambient temperature figure 14 . propagation delay time cont out(t pzh ) vs ambient temperature figure 15 . propagation delay time cont out(t phz ) vs ambient temperature 0 10 20 30 40 50 -50 -25 0 25 50 75 100 ambient temperature [c] propagation delay time [ns] operating temperature range v dd =3v v dd =5v v dd =10v v dd =18v 0 40 80 120 160 200 -50 -25 0 25 50 75 100 ambient temperature [c] propagation delay time [ns] operating temperature range v dd =3v v dd =5v v dd =10v v dd =18v downloaded from: http:///
8/ 16 tsz02201-0rdr0gz00270-1-2 ? 2014 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv typical performance curves - continued 0 40 80 120 160 200 -50 -25 0 25 50 75 100 ambient temperature [c] propagation delay time [ns] operating temperature range v dd =3v v dd =5v v dd =10v v dd =18v 0 40 80 120 160 200 -50 -25 0 25 50 75 100 ambient temperature [c] propagation delay time [ns] operating temperature range v dd =3v v dd =5v v dd =10v v dd =18v figure 16 . propagation delay time cont out(t plz ) vs ambient temperature figure 17 . propagation delay time cont out(t pzl ) vs ambient temperature downloaded from: http:///
9/ 16 tsz02201-0rdr0gz00270-1-2 ? 20 14 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv power dissipation power dissipation (total loss) indicates the power that can be consumed by ic at t a =25c(normal temperature). ic is heated when it consumed power, and the temperature of ic c hip becomes higher than ambient temperature. the temperature that can be accepted by ic chip depends on circu it configuration, manufacturing process, and consumable power is limited. power dissipation is determined by the temp erature allowed in ic chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). the maximum junction temperature is typically equal to t he maximum value in the storage temperature range. heat generated by consumed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this heat dissipation capability(hardness of heat release) is called thermal resistance, represented by the symb ol ja (c /w ).the temperature of ic inside the package can be estimated by this thermal resistance. figure 11 shows the model of thermal resistance of the package. t hermal resistance ja , ambient temperature t a , maximum junction temperature t jmax , and power dissipation p d can be calculated by the equation below: ja = (t jmax - t a ) / p d (c /w ) derating curve in figure 12 indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambie nt temperature. this gradient is determined by thermal resistance ja . thermal resistance ja depends on chip size, power consumption, package, ambi ent temperature, package condition, wind velocity, etc even when the same of pack age is used. thermal reduction curve indicates a referenc e value measured at a specified condition. i/o equivalent circuits pin no. input terminals input/output terminals 5,6,12,13 1,2,3,4,8,9,10,11 equivalence circuit figure 19. derating curve figure 18. thermal resistance ?? ta [ ] ? ? tj [ ] M p [w] ambient temperature t a ( ) chip surface temperature t j ( ) ja =( t jmax - t a )/ p d (c /w ) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 25 50 75 100 125 150 ambient temperature [ ] power dissipation [w] bu4066bcf (sop14) 85 bu40 66 bc(dip14) bu40 66 bcfv (ssop-b14) v ee vdd vdd v ee v ee vdd vdd downloaded from: http:///
10 / 16 tsz02201-0rdr0gz00270-1-2 ? 20 14 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting th e analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage above that of the vdd pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute m aximum rating of the pd stated in this specification is wh en the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
11 / 16 tsz02201-0rdr0gz00270-1-2 ? 20 14 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos trans istor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitabl y formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutu al interference among circuits, operational faults, or physi cal damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoid ed. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even i f the power supply voltage is applied, make sure that th e input pins have voltages within the values specified in the e lectrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). downloaded from: http:///
12 / 16 tsz02201-0rdr0gz00270-1-2 ? 20 14 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv ordering information b u 4 0 6 6 b c x x - x x part number bu 4066bc bu4066bcf bu4066bcfv package none: dip14 f : sop14 fv : ssop-b14 packaging and forming specification none: tube e2 : embossed tape and reel marking diagrams sop14(top view) bu4066bcf part number marking lot number 1pin mark di p14(top view) b u 4 0 6 6 b c part number marking lot number ssop- b1 4(top view) 4066c part number marking lot number 1pin mark downloaded from: http:///
13 / 16 tsz02201-0rdr0gz00270-1-2 ? 20 14 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv physical dimension, tape and reel information package name dip 14 downloaded from: http:///
14 / 16 tsz02201-0rdr0gz00270-1-2 ? 20 14 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv physical dimension, tape and reel information C continued package name sop14 (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr)) downloaded from: http:///
15 / 16 tsz02201-0rdr0gz00270-1-2 ? 20 14 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv physical dimension, tape and reel information C continued package name ssop-b14 downloaded from: http:///
16 / 16 tsz02201-0rdr0gz00270-1-2 ? 20 14 rohm co., ltd. all rights reserved. 12.nov.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bu40 66 bc bu40 66 bcf bu4066bcfv revision history date revision changes 12 .nov.2014 001 new release downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific app lications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arisi ng from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solel y responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is in dicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to ap plication example contained in this document is for referen ce only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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